Technical Roadmap
Laser drilled – Via (LVH)
75um drill dia./225um pad size
Line Width / Space
Min. 50um/65um
Pad size =Drill dia.+200um
200um Drill dia. (PTH)
Min. Solder mask clearance 35um
Laser via pitch Min. 325um
75um Laser Drill dia.
LVH Aspect Ratio
Min. PP thickness 40um
Min. core thickness 50um
*Aspect Ratio = ratio of the depth of a hole to its preplated diameter
Max. PTH/LVH Aspect Ratio
Materal
9:1 / 1:1
10:1 / 1:1
10:1 / 1:1
Normal material : Tg 140 / Tg 150 / Tg 170
Halogen Free : Tg 140 / Tg 150 / Tg 170
Min. core thickness
Min. PP thickness
2
1.5
1.8
1.4
1.8
1.2
Solder mask registration
Solder mask Color
1.2
1
1
Green, Blue, Yellow, Red, Black, White
Legend Color
Impedance Control
White, Black
±10%
±8%
±8%
E-Test
Surface Finish Availability
Manual Tester, Universal Tester, 4-Wire Tester
OSP, ENIG, LF-HASL, ENIG+OSP, Carbon+OSP
Item
HDI stack up
PTH Size / PAD Size
Current
Any Layer
8/16
2018 4Q
Any Layer
6/14
2019
Any Layer
6/13
6/13
Any Layer
6/14
Any Layer
8/16
Any Layer
PTH Size / PAD Size
HDI stack up
LVH Size / PAD Size
Line Width / Space
3/9
2/2.5
3/8
2/2
3/8
2/2