Technical Roadmap

Laser drilled – Via (LVH)

75um drill dia./225um pad size

Line Width / Space

Min. 50um/65um

Pad size =Drill dia.+200um

200um Drill dia. (PTH)

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Min. Solder mask clearance 35um

 Laser via pitch Min. 325um

75um Laser Drill dia.

LVH Aspect Ratio

Min. PP thickness 40um

Min. core thickness 50um

*Aspect Ratio = ratio of the depth of a hole to its preplated diameter

Max. PTH/LVH Aspect Ratio

Materal

9:1 / 1:1

10:1 / 1:1

10:1 / 1:1

     Normal material : Tg 140 / Tg 150 / Tg 170
     Halogen Free : Tg 140  / Tg 150 / Tg 170

Min. core thickness

Min. PP thickness

2

1.5

1.8

 1.4

1.8

1.2

Solder mask registration

Solder mask Color

1.2

1

1

Green, Blue, Yellow, Red, Black, White

Legend Color

Impedance Control

White, Black

±10%

±8%

±8%

E-Test

Surface Finish Availability

Manual Tester, Universal Tester, 4-Wire Tester

OSP, ENIG, LF-HASL, ENIG+OSP, Carbon+OSP

Item

HDI stack up

PTH Size / PAD Size

Current

Any Layer

8/16

2018 4Q

Any Layer

6/14

2019

Any Layer

6/13

6/13

Any Layer

6/14

Any Layer

8/16

Any Layer

PTH Size / PAD Size

HDI stack up

LVH Size / PAD Size

Line Width / Space

3/9

2/2.5

3/8

2/2

3/8

2/2